New Material Could Cool Electronics 100 Times More Efficiently

Thermal Ground Plane Conductive Material Georgia Tech

From Popsci.com:

Georgia Tech researchers are working on a new novel material for cooling high-powered military radar gear up to 100 times better than current conductive heat-dissipation technology.

Developed in conjunction with Raytheon and DARPA, the material is a composite of copper and diamond, two of the most effective heat-conducting materials. The composite would serve as part of a sandwich of cooling materials called a Thermal Ground Plane, which, combined with a liquid cooling setup, would surround the transmit/receive module in a radar system.

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